Solid state intermetallic compound layer growth between copper and hot dipped indium coatings
Identifieur interne : 000089 ( Main/Exploration ); précédent : 000088; suivant : 000090Solid state intermetallic compound layer growth between copper and hot dipped indium coatings
Auteurs : RBID : ISTEX:10853_1995_Article_BF01154497.pdfAbstract
Solid state growth of intermetallic compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich intermetallic compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich intermetallic layer, Cu57In43, at the interface. Total intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.
DOI: 10.1007/BF01154497
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Kilgo</name><affiliation wicri:level="1"><mods:affiliation>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM, USA</mods:affiliation><country xml:lang="fr">États-Unis</country><wicri:regionArea>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM</wicri:regionArea><placeName><region type="state">Nouveau-Mexique</region></placeName></affiliation></author><author><name>R. Grant</name><affiliation wicri:level="1"><mods:affiliation>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM, USA</mods:affiliation><country xml:lang="fr">États-Unis</country><wicri:regionArea>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM</wicri:regionArea><placeName><region type="state">Nouveau-Mexique</region></placeName></affiliation></author></titleStmt><publicationStmt><idno type="RBID">ISTEX:10853_1995_Article_BF01154497.pdf</idno><date when="1995">1995</date><idno type="doi">10.1007/BF01154497</idno><idno type="wicri:Area/Main/Corpus">000758</idno><idno type="wicri:Area/Main/Curation">000758</idno><idno type="wicri:Area/Main/Exploration">000089</idno></publicationStmt></fileDesc><profileDesc><textClass></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="eng">Solid state growth of intermetallic compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich intermetallic compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich intermetallic layer, Cu57In43, at the interface. Total intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.</div></front></TEI><mods xsi:schemaLocation="http://www.loc.gov/mods/v3 file:///applis/istex/home/loadistex/home/etc/xsd/mods.xsd" version="3.4" istexId="81376d1cbf7e98d8401326b8749026e5c31cdbc1"><titleInfo lang="eng"><title>Solid state intermetallic compound layer growth between copper and hot dipped indium coatings</title></titleInfo><name type="personal"><namePart type="given">P. T.</namePart><namePart type="family">Vianco</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM, USA</affiliation></name><name type="personal"><namePart type="given">A. C.</namePart><namePart type="family">Kilgo</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM, USA</affiliation></name><name type="personal"><namePart type="given">R.</namePart><namePart type="family">Grant</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Center for Solder Science and Technology, Sandia National Laboratories, Albuquerque, NM, USA</affiliation></name><typeOfResource>text</typeOfResource><genre>Original Paper</genre><originInfo><publisher>Kluwer Academic Publishers, Dordrecht</publisher><dateCreated encoding="w3cdtf">1994-09-29</dateCreated><dateCaptured encoding="w3cdtf">1995-04-11</dateCaptured><dateValid encoding="w3cdtf">2005-01-29</dateValid><copyrightDate encoding="w3cdtf">1995</copyrightDate></originInfo><language><languageTerm type="code" authority="iso639-2b">eng</languageTerm></language><physicalDescription><internetMediaType>text/html</internetMediaType></physicalDescription><abstract lang="eng">Solid state growth of intermetallic compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich intermetallic compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich intermetallic layer, Cu57In43, at the interface. Total intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.</abstract><relatedItem type="series"><titleInfo type="abbreviated"><title>J Mater Sci</title></titleInfo><titleInfo><title>Journal of Materials Science</title><partNumber>Year: 1995</partNumber><partNumber>Volume: 30</partNumber><partNumber>Number: 19</partNumber></titleInfo><genre>Archive Journal</genre><originInfo><dateIssued encoding="w3cdtf">1995-10-01</dateIssued><copyrightDate encoding="w3cdtf">1995</copyrightDate></originInfo><subject usage="primary"><topic>Chemistry</topic><topic>Polymer Sciences</topic><topic>Industrial Chemistry/Chemical Engineering</topic><topic>Characterization and Evaluation Materials</topic><topic>Mechanics</topic></subject><identifier type="issn">0022-2461</identifier><identifier type="issn">Electronic: 1573-4803</identifier><identifier type="matrixNumber">10853</identifier><identifier type="local">IssueArticleCount: 38</identifier><recordInfo><recordOrigin>Chapman & Hall, 1995</recordOrigin></recordInfo></relatedItem><identifier type="doi">10.1007/BF01154497</identifier><identifier type="matrixNumber">Art16</identifier><identifier type="local">BF01154497</identifier><accessCondition type="use and reproduction">MetadataGrant: OpenAccess</accessCondition><accessCondition type="use and reproduction">AbstractGrant: OpenAccess</accessCondition><accessCondition type="restriction on access">BodyPDFGrant: Restricted</accessCondition><accessCondition type="restriction on access">BodyHTMLGrant: Restricted</accessCondition><accessCondition type="restriction on access">BibliographyGrant: Restricted</accessCondition><accessCondition type="restriction on access">ESMGrant: Restricted</accessCondition><part><extent unit="pages"><start>4871</start><end>4878</end></extent></part><recordInfo><recordOrigin>Chapman & Hall, 1995</recordOrigin><recordIdentifier>10853_1995_Article_BF01154497.pdf</recordIdentifier></recordInfo></mods></record>Pour manipuler ce document sous Unix (Dilib)
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